Package warpage control
A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate havi...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
24.04.2007
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Subjects | |
Online Access | Get full text |
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Summary: | A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate. |
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Bibliography: | Application Number: US20040856371 |