Polishing composition

A polishing composition comprising 0.03 to 0.5% by weight of an organic acid or a salt thereof, an abrasive and water, wherein the abrasive has a surface potential of from -140 to 200 mV; a roll-off reducing agent comprising an inorganic compound having a property of controlling a surface potential...

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Bibliographic Details
Main Authors KITAYAMA HIROAKI, HAGIHARA TOSHIYA, FUJII SHIGEO
Format Patent
LanguageEnglish
Published 17.04.2007
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
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Summary:A polishing composition comprising 0.03 to 0.5% by weight of an organic acid or a salt thereof, an abrasive and water, wherein the abrasive has a surface potential of from -140 to 200 mV; a roll-off reducing agent comprising an inorganic compound having a property of controlling a surface potential of an abrasive in a polishing composition, wherein a surface potential of the abrasive in a standard polishing composition is controlled to -110 to 250 mV by the presence of the inorganic compound, wherein the standard polishing composition is prepared which comprises 20 parts by weight of an abrasive, the abrasive being high-purity alumina having Al2O3 purity of 98.0% by weight or more composed of alpha-type corundum crystal, 1 part by weight of citric acid, 78 parts by weight of water and 1 part by weight of an inorganic compound. The polishing composition or the roll-off reducing agent composition can be favorably used in polishing the substrate for precision parts.
Bibliography:Application Number: US20030625610