Single-stage and multi-stage low power interconnect architectures
An interconnect architecture is provided to reduce power consumption. A first driver may drive signals on a first interconnect and a second driver may drive signals on a second interconnect. The first driver may be powered by a first voltage and the second driver may be powered by a second voltage d...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | English |
Published |
13.03.2007
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Subjects | |
Online Access | Get full text |
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Abstract | An interconnect architecture is provided to reduce power consumption. A first driver may drive signals on a first interconnect and a second driver may drive signals on a second interconnect. The first driver may be powered by a first voltage and the second driver may be powered by a second voltage different than the first voltage. |
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AbstractList | An interconnect architecture is provided to reduce power consumption. A first driver may drive signals on a first interconnect and a second driver may drive signals on a second interconnect. The first driver may be powered by a first voltage and the second driver may be powered by a second voltage different than the first voltage. |
Author | TSCHANZ JAMES W KRISHNAMURTHY RAM ISMAIL YEHEA I GHONEIMA MAGED M KHELLAH MUHAMMAD M CAPUTA PETER DE VIVEK K YE YIBEN |
Author_xml | – fullname: YE YIBEN – fullname: KHELLAH MUHAMMAD M – fullname: DE VIVEK K – fullname: KRISHNAMURTHY RAM – fullname: ISMAIL YEHEA I – fullname: GHONEIMA MAGED M – fullname: CAPUTA PETER – fullname: TSCHANZ JAMES W |
BookMark | eNrjYmDJy89L5WRwDM7MS89J1S0uSUxPVUjMS1HILc0pyYTyc_LLFQryy1OLFDLzSlKLkvPz8lKTSxQSi5IzMkuArNKi1GIeBta0xJziVF4ozc2g4OYa4uyhm1qQH59aXJCYnJqXWhIfGmxuaGlgZGHmZGRMhBIA5zYzvQ |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences Physics |
ExternalDocumentID | US7190286B2 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US7190286B23 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 15:32:44 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US7190286B23 |
Notes | Application Number: US20050314236 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070313&DB=EPODOC&CC=US&NR=7190286B2 |
ParticipantIDs | epo_espacenet_US7190286B2 |
PublicationCentury | 2000 |
PublicationDate | 20070313 |
PublicationDateYYYYMMDD | 2007-03-13 |
PublicationDate_xml | – month: 03 year: 2007 text: 20070313 day: 13 |
PublicationDecade | 2000 |
PublicationYear | 2007 |
RelatedCompanies | INTEL CORPORATION |
RelatedCompanies_xml | – name: INTEL CORPORATION |
Score | 2.673081 |
Snippet | An interconnect architecture is provided to reduce power consumption. A first driver may drive signals on a first interconnect and a second driver may drive... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRONIC CIRCUITRY CALCULATING CODE CONVERSION IN GENERAL CODING COMPUTING COUNTING DECODING ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY PHYSICS |
Title | Single-stage and multi-stage low power interconnect architectures |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070313&DB=EPODOC&locale=&CC=US&NR=7190286B2 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1ba8IwFD6Iu75tbkN3Iw-jb2G06WU-lIGtRQZemHb4Jk2aDkFasR3-_Z1k1vmyPeYEwiFw7l--ADxZ3MsktwV1LeFS23EEfWGZSTE4ZJnjqJ6Dag0MR-4gtt_mzrwBy_otjOYJ3WpyRLQogfZeaX-9_m1ihRpbWT7zJYqK12jmh0ZdHSs2dmaEPb8_GYfjwAgCP54ao3ffMxVNidtDb32EWbSn0F_9j556lLI-jCjRBRxP8LC8uoSGzFtwFtQfr7XgdLibd7fgRAM0RYnCnRGWV-gJMdysJMW87lOSJE-JRgXu1qtiS9bq6zOimCA2QgFZREUOBwblNZCoPwsGFLVa7G9gEU_3-rMbaOZFLttAzBRrqRTzi8SzbC9jnAuRdXk3tbyUSSvpQOfPY27_2buD858OJqMmu4dmtfmSDxh6K_6oL-0b04eJjQ |
link.rule.ids | 230,309,783,888,25578,76884 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1La8JAEB7EPuyttS21zz2U3JaSbB56CAUTJW19UbV4E3ezKYJEMSn-_c5uo_XSHncWlmFg3jPfAjxa3EsktwV1LeFS23EErbPEpOgcksRxVM1BlQa6PTca268TZ1KC-XYXRuOEbjQ4ImqUQH3Ptb1e_RaxQj1bmT3xOZKWz-2RHxrb7FihsTMjbPqtQT_sB0YQ-OOh0Xv3PVPBlLhNtNYHGGHXFcx-66OpllJW-x6lfQqHA3wszc-gJNMqVILtx2tVOO4W_e4qHOkBTZEhsVDC7BwtIbqbhaQY131KMktjoqcCi_NiuSEr9fUZUUgQa6EGWURO9hsG2QWQdmsURBS5mu4kMB0Pd_yzSyiny1ReATFjzKVijC9mnmV7CeNciKTBG7HlxUxasxrU_nzm-p-7B6hEo25n2nnpvd3AyU81k1GT3UI5X3_JO3TDOb_XAvwGbyCMfQ |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Single-stage+and+multi-stage+low+power+interconnect+architectures&rft.inventor=YE+YIBEN&rft.inventor=KHELLAH+MUHAMMAD+M&rft.inventor=DE+VIVEK+K&rft.inventor=KRISHNAMURTHY+RAM&rft.inventor=ISMAIL+YEHEA+I&rft.inventor=GHONEIMA+MAGED+M&rft.inventor=CAPUTA+PETER&rft.inventor=TSCHANZ+JAMES+W&rft.date=2007-03-13&rft.externalDBID=B2&rft.externalDocID=US7190286B2 |