Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards

A multilayer ceramic circuit board comprises a core of high conductivity material such as metal and an overlying layer of electrically insulating ceramic having an outer surface. In accordance with the invention, a circuit board for receiving a high power component is provided with a thermal spreadi...

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Bibliographic Details
Main Authors TORMEY ELLEN SCHWARTZ, THALER BARRY JAY, MAZZOCHETTE JOSEPH
Format Patent
LanguageEnglish
Published 27.02.2007
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A multilayer ceramic circuit board comprises a core of high conductivity material such as metal and an overlying layer of electrically insulating ceramic having an outer surface. In accordance with the invention, a circuit board for receiving a high power component is provided with a thermal spreading layer on or near the outer surface and one or more thermal vias through the ceramic to thermally couple the spreading layer to the core. The vias and the spreading layer comprise electrically insulating thermally conductive materials. The resulting structure provides rapid heat dissipation for a high power component formed or mounted on or near the spreading layer.
Bibliography:Application Number: US20030702957