Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion

An insulating layer ( 3 ) having an opening portion ( 3 a) at a position conformable to an electrode pad ( 2 ) is formed. Next, a resin projection portion ( 4 ) is formed on the insulating layer ( 3 ). Thereafter, a resist film is formed which has opening portions made in regions conformable to the...

Full description

Saved in:
Bibliographic Details
Main Authors KUROSAKA AKIHITO, SADAKATA NOBUYUKI, MASUMOTO KENJI, INABA MASATOSHI, MASUMOTO MUTSUMI, SUZUKI TAKANAO, OMINATO TADANORI, KAIZU MASAHIRO
Format Patent
LanguageEnglish
Published 02.01.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:An insulating layer ( 3 ) having an opening portion ( 3 a) at a position conformable to an electrode pad ( 2 ) is formed. Next, a resin projection portion ( 4 ) is formed on the insulating layer ( 3 ). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion ( 3 a), the resin projection portion ( 4 ) and the region sandwiched therebetween. A Cu plating layer ( 6 ) is formed by electrolytic copper plating, using the resist film as a mask.
Bibliography:Application Number: US20040949386