Flexible hybrid defect classification for semiconductor manufacturing

Hybrid methods for classifying defects in semiconductor manufacturing are provided. The methods include applying a flexible sequence of rules for defects to inspection data. The sequence of rules includes deterministic rules, statistical rules, hybrid rules, or some combination thereof. The rules in...

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Bibliographic Details
Main Authors KOWALSKI MICHAL, GAO LISHENG, TRIBBLE ARIEL, MCCAULEY SHARON, ZHANG JIANXIN, KULKARNI ASHOK, HUET PATRICK, BHAGWAT SANDEEP, CAMPOCHIARO CECELIA ANNE, WU KENONG, KINI VIVEKANAND, SHANBHAG MARUTI, RANDALL DAVID, HUANG TONG
Format Patent
LanguageEnglish
Published 28.11.2006
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:Hybrid methods for classifying defects in semiconductor manufacturing are provided. The methods include applying a flexible sequence of rules for defects to inspection data. The sequence of rules includes deterministic rules, statistical rules, hybrid rules, or some combination thereof. The rules included in the sequence may be selected by a user using a graphical interface. The method also includes classifying the defects based on results of applying the sequence of rules to the inspection data.
Bibliography:Application Number: US20040954968