Electrically conducting bonding connection

An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate ( 1 ) and the support plate ( 1 ) by providing a hole ( 4, 5 ), into which an electrically conducting bonding element ( 2 ) with a bondable surface ( 3...

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Bibliographic Details
Main Authors RAPPL HANS, GROSS KURT
Format Patent
LanguageEnglish
Published 10.10.2006
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Summary:An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate ( 1 ) and the support plate ( 1 ) by providing a hole ( 4, 5 ), into which an electrically conducting bonding element ( 2 ) with a bondable surface ( 3 ) is pressed in such a way that the support plate ( 1 ) and the bonding element ( 2 ) enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element ( 2 ).
Bibliography:Application Number: US20020196027