Heat-curable resin composition and use thereof

• Main Authors: IDENO RYUJI, KOYAMA TAKESHI, OKUO MASAMI
• Format: Patent
• Language: English
• Published: 29.08.2006
• Subjects: AUXILIARY PROCESSES IN PHOTOGRAPHY; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES; PHOTOGRAPHY; PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The heat-curable resin composition of the present invention comprises an epoxy-containing resin and a curing agent, wherein the curing agent is cyclohexanetricarboxylic acid and/or an anhydride thereof. The heat-curable resin composition exhibits an excellent curability without using an curing accelerator and provides a colorless transparent cured product which is little discolored under high-temperature conditions and irradiation conditions of high-energy light. The heat-curable resin composition is suitable for producing coating compositions, adhesives, shaped articles, protective films for color filters and sealing materials for photosemiconductors such as blue LED and white LED.