Self-aligned corrosion stop for copper C4 and wirebond
An electrical structure including a substrate and an interconnect. The substrate includes an electrically conductive and corrosion resistant metallic layer on a metal layer. The interconnect is electrically coupled to the metallic layer. A top surface of the metallic layer is above a top surface of...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
25.07.2006
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Subjects | |
Online Access | Get full text |
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Summary: | An electrical structure including a substrate and an interconnect. The substrate includes an electrically conductive and corrosion resistant metallic layer on a metal layer. The interconnect is electrically coupled to the metallic layer. A top surface of the metallic layer is above a top surface of the substrate and a bottom surface of the metallic layer is in direct mechanical contact with a first portion of a top surface of the metal layer. The metal layer is unalloyed and includes a metal. |
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Bibliography: | Application Number: US20040849459 |