Manufacturing method for electronic device and multiple layer circuits thereof

To provide a planarization method which does not depend upon the size and the density of a wiring pattern and in which a reliable wiring system and a Josephson device can be formed and wiring structure, an insulation layer is planarized by forming a reversal pattern mask of wiring and selectively re...

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Bibliographic Details
Main Authors HINODE KENJI, HIDAKA MUTSUO, NAGASAWA SHUICHI, TANABE KEIICHI, KITAGAWA YOSHIHIRO
Format Patent
LanguageEnglish
Published 25.07.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a planarization method which does not depend upon the size and the density of a wiring pattern and in which a reliable wiring system and a Josephson device can be formed and wiring structure, an insulation layer is planarized by forming a reversal pattern mask of wiring and selectively removing the insulation layer on the wiring.
Bibliography:Application Number: US20040874537