Semiconductor integrated circuit device and method of manufacturing the same

A semiconductor integrated circuit device is provided which includes a wire having a diameter equal to or less than 30 mum, and a connected member molded by a resin. The connected member includes a metal layer including a palladium layer provided at a portion to which said wire is connected. A solde...

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Bibliographic Details
Main Authors KANEDA TSUYOSHI, SUZUKI HIROMICHI, MIYAKI YOSHINORI
Format Patent
LanguageEnglish
Published 02.05.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor integrated circuit device is provided which includes a wire having a diameter equal to or less than 30 mum, and a connected member molded by a resin. The connected member includes a metal layer including a palladium layer provided at a portion to which said wire is connected. A solder containing Pb as a main composition metal is provided at a portion outside a portion molded by the resin.
Bibliography:Application Number: US20040890321