Method and apparatus for evaluating integrated circuit packages having three dimensional features

The present invention provides for methods and an apparatus for evaluating objects having three dimensional features. One method involves using both two dimensional data sets to improve the processing of three dimensional data sets. The two dimensional data set can be used to pre-qualify the three d...

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Bibliographic Details
Main Authors SCARPINE VICTOR, LEONARD PATRICK F, EVANS FRANK
Format Patent
LanguageEnglish
Published 25.04.2006
Subjects
CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
TESTING
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Summary:The present invention provides for methods and an apparatus for evaluating objects having three dimensional features. One method involves using both two dimensional data sets to improve the processing of three dimensional data sets. The two dimensional data set can be used to pre-qualify the three dimensional data set, or may be used to locate that data within the three dimensional data set that is characteristic of the three dimensional feature. The invention may include a sensor configured to capture both three dimensional and two dimensional data. The present invention provides for an efficient technique to evaluate three dimensional data. The present invention also solves heretofore unrecognized problems associated with geometric distortion.
Bibliography:Application Number: US20000680342