Immersion lithography methods using carbon dioxide
A substrate is patterned by performing immersion lithography on a photoresist layer on the substrate using carbon dioxide. The immersion layer may be provided and/or removed and/or the photoresist layer may be developed, dried and/or removed using carbon dioxide. The immersion layer can include liqu...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
18.04.2006
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Subjects | |
Online Access | Get full text |
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Summary: | A substrate is patterned by performing immersion lithography on a photoresist layer on the substrate using carbon dioxide. The immersion layer may be provided and/or removed and/or the photoresist layer may be developed, dried and/or removed using carbon dioxide. The immersion layer can include liquid and/or solid immersion layers. The need for organic solvents in immersion lithography can thereby be reduced or eliminated. |
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Bibliography: | Application Number: US20030386356 |