Immersion lithography methods using carbon dioxide

A substrate is patterned by performing immersion lithography on a photoresist layer on the substrate using carbon dioxide. The immersion layer may be provided and/or removed and/or the photoresist layer may be developed, dried and/or removed using carbon dioxide. The immersion layer can include liqu...

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Bibliographic Details
Main Authors ROLLAND JASON P, DESIMONE JOSEPH P
Format Patent
LanguageEnglish
Published 18.04.2006
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Summary:A substrate is patterned by performing immersion lithography on a photoresist layer on the substrate using carbon dioxide. The immersion layer may be provided and/or removed and/or the photoresist layer may be developed, dried and/or removed using carbon dioxide. The immersion layer can include liquid and/or solid immersion layers. The need for organic solvents in immersion lithography can thereby be reduced or eliminated.
Bibliography:Application Number: US20030386356