Semiconductor package, semiconductor device and electronic device

An insulating layer ( 3 ) having an opening portion ( 3 a) at a position conformable to an electrode pad ( 2 ) is formed. Next, a resin projection portion ( 4 ) is formed on the insulating layer ( 3 ). Thereafter, a resist film is formed which has opening portions made in regions conformable to the...

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Main Authors KUROSAKA AKIHITO, SADAKATA NOBUYUKI, MASUMOTO KENJI, INABA MASATOSHI, MASUMOTO MUTSUMI, SUZUKI TAKANAO, OMINATO TADANORI, KAIZU MASAHIRO
Format Patent
LanguageEnglish
Published 04.04.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An insulating layer ( 3 ) having an opening portion ( 3 a) at a position conformable to an electrode pad ( 2 ) is formed. Next, a resin projection portion ( 4 ) is formed on the insulating layer ( 3 ). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion ( 3 a), the resin projection portion ( 4 ) and the region sandwiched therebetween. A Cu plating layer ( 6 ) is formed by electrolytic copper plating, using the resist film as a mask.
Bibliography:Application Number: US20030442298