Dual damascene circuit with upper wiring and interconnect line positioned in regions formed as two layers including organic polymer layer and low-permittivity layer

A dual damascene circuit has lower wiring and upper wiring positioned in regions formed as two layers including a CH-based organic polymer layer and a low-permittivity layer made of porous MSQ or the like. The organic polymer layer and the low-permittivity layer have high etching selectively with re...

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Bibliographic Details
Main Author USAMI TATSUYA
Format Patent
LanguageEnglish
Published 20.12.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A dual damascene circuit has lower wiring and upper wiring positioned in regions formed as two layers including a CH-based organic polymer layer and a low-permittivity layer made of porous MSQ or the like. The organic polymer layer and the low-permittivity layer have high etching selectively with respect to each other to form an upper groove and a via hole to a good shape, allowing upper wiring and the interconnect line to have good electric characteristics. The organic polymer layer and the low-permittivity layer are low in density and permittivity, thus reducing the effective permittivity of the dual damascene circuit in its entirety.
Bibliography:Application Number: US20020177667