Copper-based alloy excellent in dezincing resistance
A copper-based alloy excellent in dezincing resistance comprises, in percentage by weight, Cu: 57-69%, Sn: 0.3-3%, Si: 0.02-1.5%, Bi: 0.5-3%, and Pb: not more than 0.2%, where the ratio of Si/Sn expressed in weight percentage is in the range of 0.05-1 and apparent zinc content as defined by the foll...
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Main Author | |
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Format | Patent |
Language | English |
Published |
13.09.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A copper-based alloy excellent in dezincing resistance comprises, in percentage by weight, Cu: 57-69%, Sn: 0.3-3%, Si: 0.02-1.5%, Bi: 0.5-3%, and Pb: not more than 0.2%, where the ratio of Si/Sn expressed in weight percentage is in the range of 0.05-1 and apparent zinc content as defined by the following formula is in the range of more than 39-50 wt. %, and the balance of unavoidable impurities: Apparent Zn content=[(Zn %+2.0xSn %+10.0xSi %)/(Cu %+Zn %+2.0xSn %+10.0xSi %)]x100. Despite the fact that contains no added environment-unfriendly Pb, the alloy exhibits enhanced cuttability, together with excellent forgeability, dezincing resistance and hot forgeability. |
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Bibliography: | Application Number: US20030694792 |