Electronic device with heat conductive encasing device

• Main Authors: DUPIN CATHERINE, GUIRAGOSSIAN NICOLAS, VENENCIE CHRISTOPHE
• Format: Patent
• Language: English
• Published: 02.08.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The invention relates to the field of electronic devices with a thermally conducting encapsulant for draining away some of the energy dissipated by the electronic components contained in the electronic device. This is an electronic device comprising: a circuit ( 7 ) on which several electronic components ( 8 ) able to dissipate energy are placed; a thermal conducting cover ( 1 ) located opposite the circuit ( 7 ); a thermally conducting encapsulant ( 4 ) placed between the circuit ( 7 ) and the cover ( 1 ) so as to ensure heat transfer, by conduction toward the cover ( 1 ), of the energy dissipated in the components ( 8 ); the respective surfaces of the encapsulant ( 4 ) and of the cover ( 1 ) which are facing each other including a number of substantially complementary recesses ( 3, 6 ) and projections ( 2, 5 ) allowing the cover ( 1 ) to fit into the encapsulant ( 4 ), and gaps (j 1 , j 2 ) being left between the recesses ( 3, 6 ) and the projections ( 2, 5 ) so as, on the one hand, to reduce the stress exerted by the cover ( 1 ) on the encapsulant ( 4 ) in the direction of the circuit ( 7 ) and on the other hand, to maintain the thermal conduction between the encapsulant ( 4 ) and the cover ( 1 ) above a given conduction threshold. The invention can be applied in particular to digital electronic cards.