Metallic nanoparticle cluster ink and method for forming metal pattern using the same

Disclosed are a metallic nanoparticle cluster ink and a method for forming a conductive metal pattern using the cluster ink. The metallic nanoparticle cluster ink comprises colloidal metallic nanoparticles and a bifunctional compound. The conductive metal pattern is formed by forming a metallic nano...

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Bibliographic Details
Main Authors CHANG SEOK, HWANG SOON TAIK, CHEON JIN WOO, LEE KYUNG BOK, PARK JONG IL, CHO SUNG NAM
Format Patent
LanguageEnglish
Published 02.08.2005
Edition7
Subjects
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Summary:Disclosed are a metallic nanoparticle cluster ink and a method for forming a conductive metal pattern using the cluster ink. The metallic nanoparticle cluster ink comprises colloidal metallic nanoparticles and a bifunctional compound. The conductive metal pattern is formed by forming a metallic nanoparticle pattern on a substrate using a mold made from PDMS (poly(dimethylsiloxane) polymer as a stamp, and heat-treating the substrate. Micrometer-sized conductive metal patterns can be easily formed on various substrates in a simple and inexpensive manner without the use of costly systems, thereby being very useful in various industrial fields.
Bibliography:Application Number: US20020329682