Electronic device cooling system and method of use
An electronic device cooling system includes a heat exchange unit; at least one cooling interface disposed at a heat-transfer interface of an electronic device, where the cooling interface is thermally coupled to the heat exchange unit; and a heat exhaust that is thermally coupled to the heat exchan...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
21.06.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | An electronic device cooling system includes a heat exchange unit; at least one cooling interface disposed at a heat-transfer interface of an electronic device, where the cooling interface is thermally coupled to the heat exchange unit; and a heat exhaust that is thermally coupled to the heat exchange unit. The heat exhaust exhausts heat from the heat exchange unit to a remote location from the electronic device. |
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Bibliography: | Application Number: US20030637138 |