Fully-molded leadframe stand-off feature

A memory card comprising a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. The traces are bent in a manner wherein the die pad and the contacts extend along respective ones of spac...

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Bibliographic Details
Main Authors KANG DAE BYOUNG, GUERRERO RAUL M, PARK CHUL WOO, ZWENGER CURTIS M
Format Patent
LanguageEnglish
Published 24.05.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A memory card comprising a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. The traces are bent in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes. Disposed on and extending from the die pad and the traces is a plurality of stand-offs. At least one semiconductor die is attached to the die pad and electrically connected to at least one of the traces. A body at least partially encapsulates the leadframe and the semiconductor die such that the contacts are exposed in a bottom surface defined by the body.
Bibliography:Application Number: US20030459097