Separation method for object and glue membrane

• Main Authors: HUANG STORY, HUNG CHIA-HUNG, HSU JIA-BIN, LIU CHUN-HSIEN
• Format: Patent
• Language: English
• Published: 24.05.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS

The invention provides a separation method for object and glue membrane, and it is characterized: an external force such as tearing apart is pre-applied for appropriately separating the glue membrane and the object, such that the binding ability between the object and the glue membrane is reduced, and a taking-and-placing head then sucks up the object; to achieve said objective, it can arrange a vacuum sucking-up seat that is moveable and has vacuum adsorption hole under the glue membrane, and the sucking force of the vacuum sucking-up seat may generate an external force such as tearing apart to the glue membrane, and the object is then sucked up by the taking-and-placing head; it is also possible to arrange a connection rod to lower down and lift up the taking-and-placing head simultaneously and, before the taking-and-placing head is lowered down to contact the object, it may bring along the connection rod to press down the glue membrane and generate an external force such as tearing apart to the glue membrane, and the object is then sucked up by the taking-and-placing head; since the external force is not applied upon the object, so it may control the deforming rate of the objet to a minimum degree, such that the object may be avoided from being broken and be not caused to move, and it may also peel apart multiple chips, such that the production speed is increased and the taking-up time is shortened.