Power semiconductor package with strap
A semiconductor package and a method for fabricating a semiconductor package are disclosed. In one embodiment, the semiconductor package includes an exposed portion of a conductive strap at a package horizontal first surface and exposed surfaces of multiple leads at a package horizontal second surfa...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
29.03.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor package and a method for fabricating a semiconductor package are disclosed. In one embodiment, the semiconductor package includes an exposed portion of a conductive strap at a package horizontal first surface and exposed surfaces of multiple leads at a package horizontal second surface. A power semiconductor die is mounted on a die pad connected to at least one lead having an exposed surface. Heat generated by the die within the package may be dissipated through thermal paths including the exposed surfaces. |
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Bibliography: | Application Number: US20030618192 |