Semiconductor device and method of fabricating the same

• Main Author: SAKAI KATSUHISA
• Format: Patent
• Language: English
• Published: 29.03.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor device includes a first interconnection, an interlayer insulation film covering the first interconnection a contact hole provided in the interlayer insulation film and reaching the first interconnection, a first barrier metal and a tungsten plug provided in the contact hole, an oxide...