Carrier with a metal area and at least one chip configured on the metal area

A carrier has a metal area that is essentially composed of copper. A chip has a rear side metallization layer. A buffer layer, essentially composed of nickel and having a thickness of between 5 mum and 10 mum, is arranged on the metal area. The chip does not have a chip housing and is arranged on th...

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Bibliographic Details
Main Authors RAPPL HANS, GROSS KURT
Format Patent
LanguageEnglish
Published 08.03.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A carrier has a metal area that is essentially composed of copper. A chip has a rear side metallization layer. A buffer layer, essentially composed of nickel and having a thickness of between 5 mum and 10 mum, is arranged on the metal area. The chip does not have a chip housing and is arranged on the metal area, which has been provided with the buffer layer, such that only one connecting medium is arranged between the rear side metallization layer of the chip and the buffer layer.
Bibliography:Application Number: US20020057154