Electro chemical mechanical polishing method

Embodiments of the invention include a method for electro chemical mechanical polishing of a substrate. The process includes flowing an electro chemical mechanical polishing (ECMP) slurry having a high viscosity with a polishing agent over a portion of the substrate. Electrical current is passed thr...

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Bibliographic Details
Main Authors ZHU MEI, CATABAY WILBUR G
Format Patent
LanguageEnglish
Published 22.02.2005
Edition7
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
TRANSPORTING
WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OFELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKESTHE PLACE OF A TOOL
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Summary:Embodiments of the invention include a method for electro chemical mechanical polishing of a substrate. The process includes flowing an electro chemical mechanical polishing (ECMP) slurry having a high viscosity with a polishing agent over a portion of the substrate. Electrical current is passed through the slurry and substrate. The electrical current, in conjunction with the abrading action of the slurry as it flows over the surface of the substrate, serves to remove at least a portion of the metal layer from the substrate. The invention also includes various slurry embodiments.
Bibliography:Application Number: US20020195044