Self-assembled nanobump array stuctures and a method to fabricate such structures

A self-assembled nanobump array structure including a semi-absorbing outer layer provided on at least one nanobump-forming substrate layer, the semi-absorbing outer layer configured to ablate slowly to allow an applied laser energy to be transmitted to the at least one nanobump-forming substrate lay...

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Bibliographic Details
Main Authors NG SIMON, IEZZI RAYMOND, AUNER GREGORY W, NAIK RATNA, ABRAMS GARY W, MCCALLISTER JAMES PATRICK
Format Patent
LanguageEnglish
Published 08.02.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDUCTANCES
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MACHINE TOOLS
MAGNETS
MEASURING
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PHYSICS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TESTING
TRANSFORMERS
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A self-assembled nanobump array structure including a semi-absorbing outer layer provided on at least one nanobump-forming substrate layer, the semi-absorbing outer layer configured to ablate slowly to allow an applied laser energy to be transmitted to the at least one nanobump-forming substrate layer, in which the self-assembled nanobump array structure is formed by an energy and a pressure buildup occurring in the at least one nanobump-forming substrate layer.
Bibliography:Application Number: US20030353756