Dual damascene semiconductor devices

• Main Author: OKABE ICHIRO
• Format: Patent
• Language: English
• Published: 08.02.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor device has a wiring slot and two wiring layers connected by a via hole. The semiconductor device is formed using a photodegradable polymer film that degrades under UV radiation. An incidence angle theta of radiation rays in the irradiating step with respect to a perpendicular directi...