Injection molding of ceramic powders using non-gel forming water soluble organic binders
A method for compounding gel-free injection molding feed stock for injection molding net-shape ceramic parts, including the steps of: mixing inorganic particles with non-gel forming water soluble organic binders having molecular weight between 1000 and 1,000,000 and that are between 0.5 weight % and...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
18.01.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A method for compounding gel-free injection molding feed stock for injection molding net-shape ceramic parts, including the steps of: mixing inorganic particles with non-gel forming water soluble organic binders having molecular weight between 1000 and 1,000,000 and that are between 0.5 weight % and 10 weight % based upon the inorganic particles, along with plasticizers, water and processing aids in a mixer to form a mixture, wherein the non-gel forming water soluble organic binders are composed of high and low molecular weight organic binders; compounding the mixed inorganic particles and the non-gel forming water soluble organic binders at a high temperature in the range of between 70° and 98° Centigrade, under shear force, to form a homogenous viscous slurry in the range of 5x10 and 7x10 Pa.sec at a shear rate of 10 sec<-1>; cooling the homogenous viscous slurry to room temperature to form a compounded solid mass. |
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Bibliography: | Application Number: US20010916860 |