High modulus filler for low k materials

Disclosed are methods for processing a low k material involving providing a low k material layer comprising one or more low k polymer materials and one or more high modulus fillers on a semiconductor substrate, and chemical mechanical polishing the low k material layer so as to remove a portion of t...

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Bibliographic Details
Main Authors LYONS CHRISTOPHER F, RANGARAJAN BHARATH
Format Patent
LanguageEnglish
Published 14.09.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed are methods for processing a low k material involving providing a low k material layer comprising one or more low k polymer materials and one or more high modulus fillers on a semiconductor substrate, and chemical mechanical polishing the low k material layer so as to remove a portion of the low k material layer from the semiconductor substrate without substantially damaging unremoved portions of the low k material layer. In this connection, low k material layers for a semiconductor structure containing one or more low k polymer materials and one or more high modulus fillers are disclosed, as well as methods of making the low k material layers.
Bibliography:Application Number: US20020302227