Method and system for sensing IC package orientation in sockets
An embodiment of this invention provides a system and method for indicating the orientation of a packaged IC in a socket. An LED is physically mounted to a socket. One lead of the LED is electrically connected to a positive voltage through a socket hole on the socket. When the orientation of the IC...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
07.09.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | An embodiment of this invention provides a system and method for indicating the orientation of a packaged IC in a socket. An LED is physically mounted to a socket. One lead of the LED is electrically connected to a positive voltage through a socket hole on the socket. When the orientation of the IC package in the socket is correct, the other lead of the LED is connected to a ground path on the packaged IC. As a result, the LED is activated indicating the orientation of the packaged IC is correct. |
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Bibliography: | Application Number: US20030420577 |