Crosslinked pressure sensitive adhesive compositions, and adhesive articles based thereon, useful in high temperature applications

Pressure sensitive adhesive compositions, and adhesive articles based thereon, crosslinked using a bis-amide crosslinking agent that are thermally stable, yet cleanly removable from a variety of substrates following exposure to high temperatures.

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Bibliographic Details
Main Authors ENGLE LORI P, ZHOU ZHIMING
Format Patent
LanguageEnglish
Published 17.08.2004
Edition7
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
USE OF MATERIALS AS ADHESIVES
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Summary:Pressure sensitive adhesive compositions, and adhesive articles based thereon, crosslinked using a bis-amide crosslinking agent that are thermally stable, yet cleanly removable from a variety of substrates following exposure to high temperatures.
Bibliography:Application Number: US20010998935