Hot melt material application system with high temperature pressure monitoring and heated recirculating manifolds

• Main Authors: WARYU JOSEPH C, LOPARO THOMAS A, DILLON JOHN C, ROOS JOHN P, PALMER WILLIAM L, BORDERS LENZIE L, STEWART STEPHEN P, NAGY CHARLES F
• Format: Patent
• Language: English
• Published: 22.06.2004
• Edition: 7
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; ATOMISING APPARATUS; NOZZLES; PERFORMING OPERATIONS; SPRAYING APPARATUS; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

A hot melt high temperature material application system with application device pressure monitoring and heated recirculating manifold uses high temperature pressure transducers with each application device such as spray guns to monitor hot melt material application. A material supply line fitting has a calibrated orifice at the interface with a device manifold associated with each application device. In another embodiment, the calibrated orifice is located in a fluid passageway of the device manifold. The calibrated orifice corresponds in size to the opening of a nozzle of the application device. Heated recirculating manifolds are combined with hot melt material supply systems to provide uniform pressure to multiple application devices, and to recirculate material back through the supply system. Each recirculating manifold includes a heater, pressure regulator, and a recirculation path. The manifolds may be directly or remotely connected to one or more hot melt material supply systems.