Socket for IC package

A socket for an IC package avoids deformation or damage of an IC package body. The socket includes a socket body having a receptacle portion of the IC package and a plurality of contacts arranged on a bottom surface of the receptacle portion and resiliently displaceable in up and down directions. La...

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Bibliographic Details
Main Author OGURA SHIGERU
Format Patent
LanguageEnglish
Published 25.05.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRICITY
LINE CONNECTORS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:A socket for an IC package avoids deformation or damage of an IC package body. The socket includes a socket body having a receptacle portion of the IC package and a plurality of contacts arranged on a bottom surface of the receptacle portion and resiliently displaceable in up and down directions. Latches are pivotably provided in the socket body and being biased toward the receptacle portion by springs. The socket further includes connecting metals provided for relative motion with respect to the socket body and for moving the latches away from the receptacle portion against the springs, slots and projections restricting motion magnitude toward the bottom surface of the receptacle portion at a predetermined value.
Bibliography:Application Number: US20020153638