Method for removing soldering flux residue from a substrate

A method for removing soldering flux residue from a substrate, such as soldering flux residue formed around solder joints between a chip package and a circuit board, the method including steps of placing the joined circuit board and chip package in isopropyl alcohol to solvate the soldering flux res...

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Bibliographic Details
Main Authors ROSSER ROBIN W, LANE WILBUR R
Format Patent
LanguageEnglish
Published 06.04.2004
Edition7
Subjects
ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES
CANDLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
CLEANING
CLEANING IN GENERAL
DETERGENT COMPOSITIONS
DETERGENTS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FATTY ACIDS THEREFROM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
PRINTED CIRCUITS
RECOVERY OF GLYCEROL
RESIN SOAPS
SOAP OR SOAP-MAKING
TRANSPORTING
USE OF SINGLE SUBSTANCES AS DETERGENTS
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Summary:A method for removing soldering flux residue from a substrate, such as soldering flux residue formed around solder joints between a chip package and a circuit board, the method including steps of placing the joined circuit board and chip package in isopropyl alcohol to solvate the soldering flux residue, agitating the isopropyl alcohol to break up the soldering flux residue, removing the joined circuit board and chip package from the isopropyl alcohol, drying broken soldering flux residue that is on the joined circuit board and chip package, and spraying the soldering flux residue, that is on the joined circuit board and chip package, with an aqueous cleaner that contains an alkaline compound, to remove broken soldering flux residue that is around the solder joints.
Bibliography:Application Number: US20020308979