Package of a chip with beveled edges

A chip with beveled edges suitable for adhering onto a surface of a die pad by an adhesive material. The chip has an active surface and a corresponding back surface, wherein the active surface has beveled edges. The back surface of the chip is adhered onto the surface of the die pad by the adhesive...

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Bibliographic Details
Main Authors HSIAO WEI-MIN, CHEN JIANNG
Format Patent
LanguageEnglish
Published 02.03.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A chip with beveled edges suitable for adhering onto a surface of a die pad by an adhesive material. The chip has an active surface and a corresponding back surface, wherein the active surface has beveled edges. The back surface of the chip is adhered onto the surface of the die pad by the adhesive material.
Bibliography:Application Number: US20010838752