Thermally developable materials containing backside conductive layers

Thermally developable materials that comprise a support have at least two backside layers. One of these layers can be a protective layer comprising a film-forming polymer. The materials also includes a non-imaging backside conductive layer comprising non-acicular metal antimonate particles in a mixt...

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Bibliographic Details
Main Authors SAKIZADEH KUMARS, LUDEMANN THOMAS J, LABELLE GARY E, PHAM OANH V, BHAVE APARNA V
Format Patent
LanguageEnglish
Published 10.02.2004
Edition7
Subjects
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Summary:Thermally developable materials that comprise a support have at least two backside layers. One of these layers can be a protective layer comprising a film-forming polymer. The materials also includes a non-imaging backside conductive layer comprising non-acicular metal antimonate particles in a mixture of two or more polymers that includes a first polymer serving to promote adhesion of the backside conductive layer directly to the support or other layers, and a second polymer that is different than and forms a single phase mixture with the first polymer.
Bibliography:Application Number: US20020304225