Substrate polishing device and method
To address the deficiencies of the prior art, the present invention provides a polishing pad comprising a thermoplastic polymer and a method of manufacturing therefor. More specifically, the present invention polishing pad fabricated from an extruded amorphous thermoplastic and free of a gate vestig...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
10.02.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | To address the deficiencies of the prior art, the present invention provides a polishing pad comprising a thermoplastic polymer and a method of manufacturing therefor. More specifically, the present invention polishing pad fabricated from an extruded amorphous thermoplastic and free of a gate vestige. The invention also provides a method of manufacturing a polishing pad that is free from a gate vestige pad from an extruded amorphous thermoplastic. |
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Bibliography: | Application Number: US20010934780 |