Transfer body and method using the same

There is disclosed a transfer body including at least a peelable layer, a transparent conductive layer and an adhesive layer all sequentially laminated on a supporting body, wherein the supporting body has a heat resisting property enough to withstand heat treatment to the layers on the supporting b...

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Bibliographic Details
Main Authors SATO HISASHI, FURUKAWA TADAHIRO, BEKKU ICHIRO, ARAI KAZUMI
Format Patent
LanguageEnglish
Published 06.01.2004
Edition7
Subjects
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Summary:There is disclosed a transfer body including at least a peelable layer, a transparent conductive layer and an adhesive layer all sequentially laminated on a supporting body, wherein the supporting body has a heat resisting property enough to withstand heat treatment to the layers on the supporting body and a large rigidity compared with an opponent member to which the layers are to be transferred, and wherein the peelable layer is formed to have a pull strength of 100 g/cm or more.
Bibliography:Application Number: US20000670095