Method of making a printed circuit board

• Main Authors: CARLTON DONN B, CHATTERJEE DILIP K, GHOSH SYAMAL K, BLANTON THOMAS N
• Format: Patent
• Language: English
• Published: 06.01.2004
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A method of making a charge containing element including the steps of depositing and patterning a dielectric material on a surface wherein the dielectric material includes a metallo-organic component and a liquid component; and decomposing by laser light the deposited dielectric material to substantially evaporate the liquid component to cause the metallic portion of the metallo-organic component to react with oxygen causing the dielectric material to have charge-holding properties.