Integrated optical micro-electromechanical systems and methods of fabricating and operating the same

• Main Authors: MIRACKY ROBERT F, REED JASON D, HU KAI, HILBERT CLAUDE
• Format: Patent
• Language: English
• Published: 21.10.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES

An apparatus and method of fabricating and operating a micro-electromechanical systems (MEMS) integrated optical structure is disclosed. Micro-optics is integrated with MEMS actuators to provide a building block for a micro-optical communication device. Such micro-optical communication device may realize a variety of optical communication systems including optical interconnects, laser communications, or fiber optic switches. In accordance with one aspect of the present invention, a micro-optical element such as a micro-lens is advantageously integrated with an actuator such as MEMS comb drive actuator to form a MEMS lens assembly. The MEMS lens assembly is further coupled to an optical source which may provide a MEMS integrated micro-optical communication device. This integration substantially obviates the generally needed external or manual positioning of the micro-optical element to align a light beam or an optical signal being emitted from the optical source. The MEMS comb drive actuator, responsive to an actuation force, selectively positions the micro-optical element. By appropriately micro positioning a micro-optical element such as a micro-lens relative to an optical source, such as an input optical fiber or a laser diode, a focused light beam or an optical signal may be coupled to a respective optical fiber or a detector. In one embodiment, a commonly used flip chip module assembly technique may be adapted for bonding the MEMS lens assembly to a carrier substrate, which preferably receives the optical source. The carrier substrate is generally disposed on a host assembly. A flip chip based passive alignment of the MEMS lens assembly could be provided. Additionally, an active alignment of the light beam or optical signal with an optical detector may be provided, which can be maintained through a feedback loop.