Micro-ball grid array package tape including tap for testing

A package tape for testing a chip assembled by a packaging method such as a micro-ball grid array (BGA) package, whereby the chip is designed to face downward. The package tape includes one or more taps, disposed on a guard area other than an area where a semiconductor chip is attached, for testing...

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Bibliographic Details
Main Author SONG YOON-GYU
Format Patent
LanguageEnglish
Published 14.10.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A package tape for testing a chip assembled by a packaging method such as a micro-ball grid array (BGA) package, whereby the chip is designed to face downward. The package tape includes one or more taps, disposed on a guard area other than an area where a semiconductor chip is attached, for testing the semiconductor chip. One or more pads are disposed on the area where the semiconductor chip is attached and are attached to corresponding test pads on the semiconductor chip. One or more leads which electrically connect the taps with the pads. The package tape advantageously enables easy testing of the electric characteristics of the semiconductor chip, which in a typical BGA package tape cannot be tested by probing since the circuit thereof faces down.
Bibliography:Application Number: US20010940877