High density electronic circuit modules

The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module...

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Bibliographic Details
Main Authors VU DUY-PHACH, DINGLE BRENDA, CHEONG NGWE
Format Patent
LanguageEnglish
Published 30.09.2003
Edition7
Subjects
ADVERTISING
ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICESUSING STATIC MEANS TO PRESENT VARIABLE INFORMATION
BASIC ELECTRIC ELEMENTS
CRYPTOGRAPHY
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
DEVICES USING STIMULATED EMISSION
DIAGNOSIS
DISPLAY
EDUCATION
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FREQUENCY-CHANGING
HUMAN NECESSITIES
HYGIENE
IDENTIFICATION
MEDICAL OR VETERINARY SCIENCE
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEALS
SEMICONDUCTOR DEVICES
SURGERY
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Summary:The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.
Bibliography:Application Number: US20000592246