Photosensitive insulating paste and thick film multi-layer circuit substrate

A photosensitive insulating paste contains a borosilicate glass powder and a crystalline SiO2 powder, wherein the powders are dispersed in a photosensitive organic vehicle and the paste contains the crystalline SiO2 component in an amount of about 3-40 wt. % after sintering. A thick-film multi-layer...

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Bibliographic Details
Main Authors TOSE MAKOTO, KAWAKAMI HIROMICHI, WATANABE SHIZUHARU
Format Patent
LanguageEnglish
Published 05.08.2003
Edition7
Subjects
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Summary:A photosensitive insulating paste contains a borosilicate glass powder and a crystalline SiO2 powder, wherein the powders are dispersed in a photosensitive organic vehicle and the paste contains the crystalline SiO2 component in an amount of about 3-40 wt. % after sintering. A thick-film multi-layer circuit substrate (e.g., chip inductor) comprising an insulating substrate on which insulating layers are formed, wherein the insulating layers are formed through exposure, development and sintering, after the application of the photosensitive insulating paste.
Bibliography:Application Number: US20010915704