Serpentine, slit fin heat sink device

A serpentine, slit fin (26) is provided for a heat sink device (10) used for cooling a electronic component (12) having a surface (14) that rejects heat. The heat sink (10) includes a plate (16) having first and second surfaces (18, 20), with the first surface (18) configured to receive heat from th...

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Bibliographic Details
Main Authors ROGERS C. JAMES, CHEEMA RIFAQUAT, HUGHES GREGORY G, ZHANG L. WINSTON, GRIPPE FRANK M
Format Patent
LanguageEnglish
Published 08.07.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A serpentine, slit fin (26) is provided for a heat sink device (10) used for cooling a electronic component (12) having a surface (14) that rejects heat. The heat sink (10) includes a plate (16) having first and second surfaces (18, 20), with the first surface (18) configured to receive heat from the surface (14) of the electronic component (12). The fin (26) is bonded to the second surface and includes a plurality of offset sidewall portions (48). In one form, a fan (22) is spaced above the second surface (20) to direct an impingement airflow (24) towards the second surface (20) substantially perpendicular to the second surface (20), and the serpentine, slit fin (26) underlies the fan (22) and is bonded to the second surface (20).
Bibliography:Application Number: US20020098000