Chemical-mechanical polishing pad conditioning system and method

A chemical-mechanical polishing pad conditioning system and method. The system includes a conditioning device that may be used to condition a polishing pad. The system may also include a first conduit for introducing a chemical reagent onto the polishing pad, a second and third conduit for introduci...

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Bibliographic Details
Main Authors KAISER JOHN A, PAGE CARY R, SAENZ MOSES R
Format Patent
LanguageEnglish
Published 29.04.2003
Edition7
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:A chemical-mechanical polishing pad conditioning system and method. The system includes a conditioning device that may be used to condition a polishing pad. The system may also include a first conduit for introducing a chemical reagent onto the polishing pad, a second and third conduit for introducing the chemical reagent and a rinsing fluid respectively onto a conditioning surface of the.conditioning device or a storage apparatus of the conditioning device. The method includes introducing the chemical reagent onto the polishing pad during the pad conditioning process. The chemical reagent may further be introduced onto the storage apparatus or be introduced onto the conditioning surface of the conditioning device. The rinsing fluid may be introduced onto the polishing pad, the storage apparatus, or the conditioning surface.
Bibliography:Application Number: US20000690704