Method of patterning a thin layer by chemical etching

• Main Authors: KUBO AKIRA, MIZOUCHI KIYOTSUGU, MACHIDA MASAHIKO
• Format: Patent
• Language: English
• Published: 01.04.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; SEMICONDUCTOR DEVICES

A method of patterning a thin layer into a predetermined shape on the basis of a pattern layer arranged in a thin layer formed in a substrate comprises a first step of soaking the substrate in a first solution to etch off the thin layer on the basis of the pattern layer, a second step of spraying a second solution having the same composition as that of an etching solution used in a third step to wash the substrate, and a third step of soaking the substrate in a third solution to further etch the thin layer.