Built-in inspection template for a printed circuit

An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area o...

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Bibliographic Details
Main Authors POTENZA JOHN A, YOUNG J. ROBERT, BROWN MARSHALL L, PHILLIPS, JR. RAYMOND A, SHUPP JIRINA D, BUSBY JAMES A
Format Patent
LanguageEnglish
Published 04.02.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.
Bibliography:Application Number: US20010757523