Flip chip package with improved cap design and process for making thereof

• Main Authors: FARQUHAR DONALD S, HOUSER DAVID E, PAPATHOMAS KONSTANTINOS I
• Format: Patent
• Language: English
• Published: 31.12.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with heat spreading perforated cap wherein the perforations are filled with an adhesive to prevent delamination...