Flip chip package with improved cap design and process for making thereof

Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with heat spreading perforated cap wherein the perforations are filled with an adhesive to prevent delamination...

Full description

Saved in:
Bibliographic Details
Main Authors FARQUHAR DONALD S, HOUSER DAVID E, PAPATHOMAS KONSTANTINOS I
Format Patent
LanguageEnglish
Published 31.12.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with heat spreading perforated cap wherein the perforations are filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, resulting in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.
Bibliography:Application Number: US20010774152