Junction assembly of bonding pad and bump, and magnetic head device using the same

A bonding pad and a copper bump are bonded to each other by soldering. When the amount of Au melting into a soldering junction is not more than 9 percent by weight, the amounts of the precipitation of compounds of Au in the solder or on the surface thereof can be reduced and the bonding strength of...

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Bibliographic Details
Main Authors YAMAGUCHI OOKI, NAITO KOICHI
Format Patent
LanguageEnglish
Published 05.11.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CURRENT COLLECTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
LINE CONNECTORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Summary:A bonding pad and a copper bump are bonded to each other by soldering. When the amount of Au melting into a soldering junction is not more than 9 percent by weight, the amounts of the precipitation of compounds of Au in the solder or on the surface thereof can be reduced and the bonding strength of the soldering junction can be enhanced.
Bibliography:Application Number: US20000498955